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Greece IC.LED. Precision manual punching jig for semiconductor frame
Customization: Place the wafer support into the positioning hole in the manual jig, and punch 8/4/2/atomic particles at one time, which is convenient and light. At the same time, the positioning hole can be punched.
Category:
GreecePrecision laser cutting
Product Description
Precision manual punching jig production instructions:
Customization: Place the wafer support into the positioning hole in the manual jig, and punch 8/4/2/atomic particles at one time, which is convenient and light. At the same time, the positioning hole can be punched.
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