high-speed laser marking

high-speed laser marking

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IC. LED. Semiconductor. Automatic cutting of lead frames such as wafers, precision laser welding machine (Type A)

IC. LED. Semiconductor. Automatic cutting of lead frames such as wafers, precision laser welding machine (Type A)

The machine is mainly used in IC LED wafer semiconductor lead frame, stamped copper, stainless steel, iron, and other metal materials, metal phone shell, metal capacitor shell, computer metal shielding mesh, razor blade, electronic connectors and other types of electronic products high efficiency laser spot welding or seal welding.

Key words:

high-speed laser marking

IC.LED. Semiconductor precision laser punching welding machine (B type)

IC.LED. Semiconductor precision laser punching welding machine (B type)

The machine is mainly used in IC LED wafer semiconductor lead frame, stamped copper, stainless steel, iron, and other metal materials, metal phone shell, metal capacitor shell, computer metal shielding mesh, razor blade, electronic connectors and other types of electronic products high efficiency laser spot welding or seal welding.

Key words:

high-speed laser marking

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